JPH0244332U - - Google Patents

Info

Publication number
JPH0244332U
JPH0244332U JP12275388U JP12275388U JPH0244332U JP H0244332 U JPH0244332 U JP H0244332U JP 12275388 U JP12275388 U JP 12275388U JP 12275388 U JP12275388 U JP 12275388U JP H0244332 U JPH0244332 U JP H0244332U
Authority
JP
Japan
Prior art keywords
wafer
semiconductor
wafer sheet
sheet
push
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12275388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH062270Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12275388U priority Critical patent/JPH062270Y2/ja
Publication of JPH0244332U publication Critical patent/JPH0244332U/ja
Application granted granted Critical
Publication of JPH062270Y2 publication Critical patent/JPH062270Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP12275388U 1988-09-21 1988-09-21 半導体ペレット剥離装置 Expired - Lifetime JPH062270Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12275388U JPH062270Y2 (ja) 1988-09-21 1988-09-21 半導体ペレット剥離装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12275388U JPH062270Y2 (ja) 1988-09-21 1988-09-21 半導体ペレット剥離装置

Publications (2)

Publication Number Publication Date
JPH0244332U true JPH0244332U (en]) 1990-03-27
JPH062270Y2 JPH062270Y2 (ja) 1994-01-19

Family

ID=31370978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12275388U Expired - Lifetime JPH062270Y2 (ja) 1988-09-21 1988-09-21 半導体ペレット剥離装置

Country Status (1)

Country Link
JP (1) JPH062270Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171426A (ja) * 2009-01-22 2010-08-05 Esec Ag 金型排出装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171426A (ja) * 2009-01-22 2010-08-05 Esec Ag 金型排出装置

Also Published As

Publication number Publication date
JPH062270Y2 (ja) 1994-01-19

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